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Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM

Yıl 2023, Cilt: 6 Sayı: 2, 83 - 93, 30.06.2023
https://doi.org/10.35208/ert.1244563

Öz

In this study, the upcycling and recycling applications for the management of waste printed circuit boards (PCBs) were compared through the sequential application of Streamlined Life Cycle Assessment (S-LCA) and Multi-Criteria Decision Making (MCDM) techniques. Upcycling applications were determined as gold, copper-tin alloy, lead, copper recovery and activated carbon production. And, portland cement, aggregate, sawdust, fiberglass and styrene butadiene rubber (SBR) productions were taken account as recycling applications. At the S-LCA stage, CML-IA baseline and ReCiPe 2016 methods were used for the characterization. For the MCDM study, environmental, technical and economic criteria were determined. Remarkable characterization results of S-LCA were used as the environmental criteria of MCDM. The Entropy method was used for the weighting of the criteria. TOPSIS method was used to compare the alternatives based on weighted criteria. S-LCA study shows that impact categories of Abiotic Depletion Potential (element basis), Total Ecotoxicity Potential and Human Toxicity Potential are the major impact categories. MCDM study shows that the gold recovery (0.9845) as an upcycling application and SBR production (0.7361) as a recycling application have been determined as the first applications to be applied to waste PCBs in terms of environmental, technical and economic aspects.

Destekleyen Kurum

Eskişehir Teknik Üniversitesi

Proje Numarası

20ADP093

Teşekkür

This study was supported by Eskişehir Technical University Scientific Research Projects Commission under the grant number 20ADP093.

Kaynakça

  • W. Zhao, J. Xu, W. Fei, Z. Liu, W. He and G. Li, “The reuse of electronic components from waste printed circuit boards: A critical review,” Environmental Science: Advances., 2, 196-214, 2023.
  • J.Van Yken, K.Y. Cheng, N.J. Boxall, A.N. Nikoloski, N. Moheimani, M. Valix, M., ... and A.H. Kaksonen, “Potential of metals leaching from printed circuit boards with biological and chemical lixiviants,” Hydrometallurgy, 196, 105433, 2020.
  • Y.Zhu, B. Li, Y. Wei, S. Zhou and H. Wang, “Recycling potential of waste printed circuit boards using pyrolysis: Status quo and perspectives,” Process Safety and Environmental Protection, 173, 437-451, 2023.
  • J. Chen, J. He, L. Zhu, Q. Yao, Y. Sun, C. Guo, B. Yang, “Efficient recovery of valuable metals from waste printed circuit boards via ultrasound-enhanced flotation,” Process Safety and Environmental Protection, 169, 869-878, 2023.
  • L. Ali, H.A. Mousa, M. Al-Harahsheh, S. Al-Zuhair, B. Abu-Jdayil, M. Al-Marzouqi and M.Altarawneh, “Removal of bromine from the non-metallic fraction in printed circuit board via its co-pyrolysis with alümina,” Waste Management, 137, 283-293, 2022.
  • M.Y.Khalid, Z.U. Arif, W. Ahmed and H. Arshad, “Recent trends in recycling and reusing techniques of different plastic polymers and their composite materials,” Sustainable Materials and Technologies, 31, e00382, 2022.
  • H. Jung, G. Shin, H. Kwak, L.T. Hao, J. Jegal, H.J. Kim and D.X. Oh, “Review of polymer technologies for improving the recycling and upcycling efficiency of plastic waste,” Chemosphere, 138089, 2023.
  • K.M. Wyss, B. Deng and J.M. Tour, “Upcycling and urban mining for nanomaterial synthesis,” Nano Today, 49, 101781, 2023.
  • S. Yi, H. Lee, J. Lee and W. Kim, “Upcycling strategies for waste electronic and electrical equipment based on material flow analysis,” Environmental Engineering Research, 24(1), 74-81, 2019.
  • L.H. Xavier, M. Ottoni and L.P.P. Abreu, “A comprehensive review of urban mining and the value recovery from e-waste materials,” Resources, Conservation and Recycling, 190, 106840, 2023.
  • G.Martinez-Ballesteros, J.L.Valenzuela-Garcia, A. Gomez-Alvarez, M.A.Encinas-Romero, F.A. Mejia-Zamudio and A.D.J. Rosas-Durazo, “Base metals extraction from printed circuit boards by pressure acid leaching,” Minerals, 13(1), 98, 2023.
Yıl 2023, Cilt: 6 Sayı: 2, 83 - 93, 30.06.2023
https://doi.org/10.35208/ert.1244563

Öz

Proje Numarası

20ADP093

Kaynakça

  • W. Zhao, J. Xu, W. Fei, Z. Liu, W. He and G. Li, “The reuse of electronic components from waste printed circuit boards: A critical review,” Environmental Science: Advances., 2, 196-214, 2023.
  • J.Van Yken, K.Y. Cheng, N.J. Boxall, A.N. Nikoloski, N. Moheimani, M. Valix, M., ... and A.H. Kaksonen, “Potential of metals leaching from printed circuit boards with biological and chemical lixiviants,” Hydrometallurgy, 196, 105433, 2020.
  • Y.Zhu, B. Li, Y. Wei, S. Zhou and H. Wang, “Recycling potential of waste printed circuit boards using pyrolysis: Status quo and perspectives,” Process Safety and Environmental Protection, 173, 437-451, 2023.
  • J. Chen, J. He, L. Zhu, Q. Yao, Y. Sun, C. Guo, B. Yang, “Efficient recovery of valuable metals from waste printed circuit boards via ultrasound-enhanced flotation,” Process Safety and Environmental Protection, 169, 869-878, 2023.
  • L. Ali, H.A. Mousa, M. Al-Harahsheh, S. Al-Zuhair, B. Abu-Jdayil, M. Al-Marzouqi and M.Altarawneh, “Removal of bromine from the non-metallic fraction in printed circuit board via its co-pyrolysis with alümina,” Waste Management, 137, 283-293, 2022.
  • M.Y.Khalid, Z.U. Arif, W. Ahmed and H. Arshad, “Recent trends in recycling and reusing techniques of different plastic polymers and their composite materials,” Sustainable Materials and Technologies, 31, e00382, 2022.
  • H. Jung, G. Shin, H. Kwak, L.T. Hao, J. Jegal, H.J. Kim and D.X. Oh, “Review of polymer technologies for improving the recycling and upcycling efficiency of plastic waste,” Chemosphere, 138089, 2023.
  • K.M. Wyss, B. Deng and J.M. Tour, “Upcycling and urban mining for nanomaterial synthesis,” Nano Today, 49, 101781, 2023.
  • S. Yi, H. Lee, J. Lee and W. Kim, “Upcycling strategies for waste electronic and electrical equipment based on material flow analysis,” Environmental Engineering Research, 24(1), 74-81, 2019.
  • L.H. Xavier, M. Ottoni and L.P.P. Abreu, “A comprehensive review of urban mining and the value recovery from e-waste materials,” Resources, Conservation and Recycling, 190, 106840, 2023.
  • G.Martinez-Ballesteros, J.L.Valenzuela-Garcia, A. Gomez-Alvarez, M.A.Encinas-Romero, F.A. Mejia-Zamudio and A.D.J. Rosas-Durazo, “Base metals extraction from printed circuit boards by pressure acid leaching,” Minerals, 13(1), 98, 2023.
Toplam 11 adet kaynakça vardır.

Ayrıntılar

Birincil Dil İngilizce
Konular Çevre Mühendisliği
Bölüm Research Articles
Yazarlar

Zerrin Günkaya 0000-0002-7553-9129

Zehra Gizem Eris 0000-0002-1131-7172

Aysun Özkan 0000-0003-1036-7570

Mufide Banar 0000-0003-2795-6208

Proje Numarası 20ADP093
Yayımlanma Tarihi 30 Haziran 2023
Gönderilme Tarihi 31 Ocak 2023
Kabul Tarihi 18 Nisan 2023
Yayımlandığı Sayı Yıl 2023 Cilt: 6 Sayı: 2

Kaynak Göster

APA Günkaya, Z., Eris, Z. G., Özkan, A., Banar, M. (2023). Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM. Environmental Research and Technology, 6(2), 83-93. https://doi.org/10.35208/ert.1244563
AMA Günkaya Z, Eris ZG, Özkan A, Banar M. Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM. ERT. Haziran 2023;6(2):83-93. doi:10.35208/ert.1244563
Chicago Günkaya, Zerrin, Zehra Gizem Eris, Aysun Özkan, ve Mufide Banar. “Prioritization of Upcycling and Recycling Applications for the Management of Waste Printed Circuit Boards by Using S-LCA and MCDM”. Environmental Research and Technology 6, sy. 2 (Haziran 2023): 83-93. https://doi.org/10.35208/ert.1244563.
EndNote Günkaya Z, Eris ZG, Özkan A, Banar M (01 Haziran 2023) Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM. Environmental Research and Technology 6 2 83–93.
IEEE Z. Günkaya, Z. G. Eris, A. Özkan, ve M. Banar, “Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM”, ERT, c. 6, sy. 2, ss. 83–93, 2023, doi: 10.35208/ert.1244563.
ISNAD Günkaya, Zerrin vd. “Prioritization of Upcycling and Recycling Applications for the Management of Waste Printed Circuit Boards by Using S-LCA and MCDM”. Environmental Research and Technology 6/2 (Haziran 2023), 83-93. https://doi.org/10.35208/ert.1244563.
JAMA Günkaya Z, Eris ZG, Özkan A, Banar M. Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM. ERT. 2023;6:83–93.
MLA Günkaya, Zerrin vd. “Prioritization of Upcycling and Recycling Applications for the Management of Waste Printed Circuit Boards by Using S-LCA and MCDM”. Environmental Research and Technology, c. 6, sy. 2, 2023, ss. 83-93, doi:10.35208/ert.1244563.
Vancouver Günkaya Z, Eris ZG, Özkan A, Banar M. Prioritization of upcycling and recycling applications for the management of waste printed circuit boards by using S-LCA and MCDM. ERT. 2023;6(2):83-9.